Global Thermal Interface Materials Market 2017 Study And Analysis Research Report Forecast To 2023

Thermal Interface Materials Market 2017

Summary:

Global Thermal Interface Materials Market Information Report by Type (Greases & Adhesives, Gap Fillers, Elastomeric Pads, Metal Based, Others), By Application (Telecommunications, Computer, Automotive, Industrial Machinery, Others) and By Region - Global Forecast To 2023

Market Scenario:The thermal interface materials are the materials which possess very high thermal conductivity. They act as a link between heat sink and the source of heat generation.

The major driver for the growth of the thermal interface materials market is the emerging need of very fast computing services. The increase in the awareness for the efficient lighting systems has increased with the increase in use of LED lights over the conventional lights, which is in turn driving the thermal interface materials market. The key features of thermal interface materials such as high thermal conductivity, no leakage from interface and minimum thickness are making it suitable for use across various end-user industries such as computer, automotive and industrial machinery among others. This is in turn, leading to the growth of the thermal interface material market.

   

The Thermal interface materials market is expected to grow over the CAGR of around 10% during the period 2017 to 2023.

Key Players:The key players of Thermal interface materials market are 3M Company (U.S.), Henkel Corporation (U.S.), Bergquist Company (U.S.), Indium Corporation (U.S.), Parker Chomerics (U.S.), Dow Corning (U.S.), Laird Technologies (U.S.), Momentive Performance Materials Inc. (U.S.), and Zalman Tech Co., Ltd. (South Korea) among others.

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Study Objectives of Thermal Interface Materials Market:

• To provide detailed analysis of the market structure along with forecast for the next 5 years of the various segments and sub-segments of the global Thermal Interface Materials Market
• To provide insights about factors affecting the market growth
• To analyse the global Thermal interface materials market based on various tools such as Supply Chain Analysis, and Porter’s Five Force Analysis
• To provide historical and forecast revenue of the market segments and sub-segments with respect to regions and their respective key countries
• To provide country level analysis of the market with respect to the current market size and future prospective
• To provide country level analysis of the market for segments by type, application and region
• To provide strategic profiling of key players in the market, comprehensively analysing their core competencies, and drawing a competitive landscape for the market
• To track and analyse competitive developments such as joint ventures, strategic alliances, mergers and acquisitions, new product developments, and research and developments in the global thermal interface materials market.

Company Information:

• Profiling of 10 key market players
• In-depth analysis including SWOT analysis, and strategy information of related to report title
• Competitive landscape including emerging trends adopted by major companies

The report for global thermal interface materials market of Market Research Future comprises of extensive primary research along with the detailed analysis of qualitative as well as quantitative aspects by various industry experts, key opinion leaders to gain the deeper insight of the market and industry performance. The report gives the clear picture of current market scenario which includes historical and projected market size in terms of value, technological advancement, macro economical and governing factors in the market. The report provides details information and strategies of the top key players in the industry. The report also gives a broad study of the different market segments and regions.

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Table of Contents      

   

1 Executive Summary

…..

7 Competitive Analysis

      7.1 Introduction

      7.2 Competitive Scenario
            7.2.1 Market Share Analysis

            7.2.2 Market Development Analysis

            7.2.3 Type/Service Benchmarking

      7.3 3M Company (U.S.)
            7.3.1 Overview

            7.3.2 Type/Service Offering

            7.3.3 Strategy

      7.4 Henkel Corporation (U.S.)
            7.4.1 Overview

            7.4.2 Type/Service Offering

            7.4.3 Strategy

      7.5 Bergquist Company (U.S.)
            7.5.1 Overview

            7.5.2 Type/Service Offering

            7.5.3 Strategy

      7.6 Indium Corporation (U.S.)
            7.6.1 Overview

            7.6.2 Type/Service Offering

            7.6.3 Strategy

      7.7 Parker Chomerics (U.S.)
            7.7.1 Overview

            7.7.2 Type/Service Offering

            7.7.3 Strategy

      7.8 Dow Corning (U.S.)
            7.8.1 Overview

            7.8.2 Type/Service Offering

            7.8.3 Strategy

      7.9 Laird Technologies (U.S.)
            7.9.1 Overview

            7.9.2 Type/Service Offering

            7.9.3 Strategy

      7.10 Momentive Performance Materials Inc. (U.S.)
            7.10.1 Overview

            7.10.2 Type/Service Offering

            7.10.3 Strategy

      7.11 Zalman Tech Co., Ltd. (South Korea)
            7.11.1 Overview

            7.11.2 Type/Service Offering

            7.11.3 Strategy

Continued…….  

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